Company profile
About Company
SonicMEMS company is committed to the third-generation semiconductor material-aluminum nitride to achieve chip-level ultrasonic mems transducers technology research and development and commercialization. it is china's first self-developed aluminum (aln) chip-level ultrasonic wave-level ultrasonic production of eight-inch wafers. the sensor team fills this gap for the domestic sensor field. the chip -level ultrasonic sensor is made of aluminum nitride -based material. aluminum nitride (aln) has a good voltage effect. the lower dielectric constant makes it possible to obtain block voltage electricity under a smaller volume design. ceramics (pzt) is quite performance, and its small volume and low power consumption are more suitable for use in portable devices. maozhang company's first array -type aluminum nitride chip -type ultrasonic mems converter, and self -developed ultrasonic tdc driver read chip, using ultrasonic flight time (tof) measurement principle to achieve millimeter -level accurate distance sensing. the stage results were published and exchanged at multiple international academic conferences, such as icept 2018, ieee-nems 2019, ectc 2019, icept 2019, etc., and won the 2018 electronic packaging technology international conference best paper award, 2019 international electronic component technology conference oral report. create in the technology of aluminum nitride ultrasonic converter technology
